Online information source for semiconductor professionals
SEMATECH prepares 3D-IC workshop on manufacturing and reliability
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
The
Advanced Metallization Conference, being held from September 23-25 in
San Diego, will feature workshops, presentations and talks, one of
which will be hosted by SEMATECH. The workshop, entitled “Manufacturing
and Reliability Challenges for 3D ICs using TSVs,” will address the
applications, manufacturing processes and reliability challenges of 3D
IC integration with TSVs at the conference on September 25th.
Attendees of the SEMATECH workshop will be welcome to discuss challenges such as physical design, processing options, failure mechanisms, and practical issues that impact cost, schedule, and performance. Presenting the information will be key representatives from companies such as IBM, Qualcomm, NXP Semiconductors, Applied Materials and EV Group.
Further information on registration for the event, which is open to both SEMATECH employees and the general public, is available here.