Online information source for semiconductor professionals

SEMATECH starts extension work on immersion lithography

09 September 2005 | By Syanne Olson | News > Wafer Processing

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

SEMATECH has received a key tool for exploring the extension of immersion lithography to produce advanced semiconductors at the 45nm half-pitch lithography generation and beyond, according to the R&D centre on September 1st. The tool, an interference immersion exposure system from Amphibian Systems, will be placed in the Immersion Technology Center (iTC), which focuses on extending immersion lithography beyond pure water-based approaches.

"The Amphibian is the latest in a series of highly engineered tools that will help to explore the ultimate limits of optical lithography," said Kevin Kemp, SEMATECH's lithography director. "It also puts Texas in the forefront of one of our industry's most promising R&D initiatives."

The Amphibian system is designed to study immersion lithography with novel fluids and resists at up to 1.5 NA. The tool consists of a 2mm exposure field size, a full range of polarization controls, and the ability to image both line patterns and contact features. A fluid delivery system allows for the use of water or alternative fluids, with the ability to change fluids rapidly between wafers. The system is fully enclosed in an ultra-clean environment.

The Amphibian equipment arrived in August and will be available for use by SEMATECH and researchers from its member companies and suppliers in September. SEMATECH played a key part in the early evaluation efforts of immersion lithography which has paved the way for further research that is required to meet cost effective lithography techniques ahead of the possible adoption of EUV lithography at the 32nm node.

Related jobs

Thin Films Process Engineer - OEM Surplus, Inc. - Phoenix, 21 January 2008

Principal Engineer - FTIR Gas Analysis Algorithms - MKS Instruments, Inc. - Methuen, 07 October 2007

Electrical Engineer III - MKS Instruments, Inc. - Andover, 07 October 2007

Principal Embedded Software Engineer - MKS Instruments, Inc. - Wilmington, 05 September 2007

Technical Support Engineer - Carl Zeiss SMT, Inc. - Peabody, 10 August 2007

Related articles

The ESH impact of advanced lithography materials and processes - 01 August 2004

Grand challenges of advanced resist technology - 01 June 2005

Wet and dry 193nm ArF lithography key choice for 32nm node production - 22 May 2008

SEMATECH appoints new lithography directors from Intel & AMD - 09 September 2008

Tool Order: SEMATECH buys Imprio 300 imprint lithography tool from Molecular Imprints - 27 February 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: