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SEMATECH attracts six more semiconductor firms to 3D TSV IC program

26 April 2011 | By Mark Osborne | News > Wafer Processing

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A slew of semiconductor firms have joined a growing list of companies collaborating with SEMATECH’s 3D Enablement program based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany to develop TSV-based 3D stacked IC solutions. New partners include Advanced Semiconductor Engineering (ASE), Altera, Analog, LSI, ON Semiconductor, and Qualcomm.

“Research on 3D technologies has been ongoing for many years, and the initiative that SEMATECH has spearheaded is working to find solutions to the challenges faced by lack of standardization. We’re pleased to see this partnership expand and grow,” said Dan Armbrust, president and CEO of SEMATECH. “Thanks to these new members and our supplier partners, the 3D Enablement program truly has the potential to bring down the barriers to integrating chips for adoption of 3D technologies in high volume manufacturing.”

SEMATECH initially teamed with the SIA and SRC to launch a new 3D Enablement program in December, 2010 which was designed to drive industry standardization efforts and technical specifications for heterogeneous 3D integration. Early members included GlobalFoundries, Hewlett Packard, Hynix, IBM, Intel, Samsung, and UMC.

However, there are several other programs in Europe and Asia dealing with 3D IC developments, which are seen as future competitive technologies to create new products.

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