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SEMATECH attracts Rudolph to 3D IC program

21 April 2009 | By Mark Osborne | News > Wafer Processing

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Yet another equipment supplier is joining SEMATECH’s 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. This time its Rudolph Technologies, continuing with a collaboration in process characterization that will now focus on 3D IC (three-dimensional integrated circuits) processing and enhancing process control of TSV (through-silicon vias) manufacturing.

“The advanced device design and complex manufacturing requirements of 3D packaging opens a new frontier of process control challenges. Rudolph is well positioned, both with existing and emerging technologies, to be the semiconductor industry’s premier TSV process control solution provider,” stated Ardy Johnson, Rudolph’s vice president of marketing.


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