Online information source for semiconductor professionals

SEMATECH attracts Rudolph to 3D IC program

21 April 2009 | By Mark Osborne | News > Wafer Processing

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Yet another equipment supplier is joining SEMATECH’s 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. This time its Rudolph Technologies, continuing with a collaboration in process characterization that will now focus on 3D IC (three-dimensional integrated circuits) processing and enhancing process control of TSV (through-silicon vias) manufacturing.

“The advanced device design and complex manufacturing requirements of 3D packaging opens a new frontier of process control challenges. Rudolph is well positioned, both with existing and emerging technologies, to be the semiconductor industry’s premier TSV process control solution provider,” stated Ardy Johnson, Rudolph’s vice president of marketing.


Related articles

Accretech adds name to SEMATECH‚??s 3D Interconnect Program - 27 February 2008

Rudolph teams on integrated defect inspection for 3D stacked packaging - 19 January 2011

Tool Order: Singapore fab places multiple inspection system order with Rudolph - 08 May 2008

SEMATECH‚??s 3D Interconnect program attracts Hynix - 08 March 2011

Rudolph Technologies sells lead scanner assets to BKM Technology Partners - 15 July 2008

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: