Online information source for semiconductor professionals

SEMATECH and Canon ANELVA to team on non-volatile memory

16 April 2009 | By Mark Osborne | News > Wafer Processing

Popular articles

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

The Front End Processes (FEP) Program at SEMATECH has received a boost from Canon ANELVA Corporation in a new collaboration that will focus on materials and process techniques for future non-volatile memory (NVM) applications in the sub-40nm range. A key part of the work will be to improve material reliability and uniformity of dielectrics and metal films, using Canon ANELVA’s physical vapor deposition (PVD) technology.

“This collaborative effort reinforces SEMATECH’s commitment to develop cutting-edge memory technologies utilizing advanced materials for continued performance improvement of semiconductor technologies,” said Raj Jammy, vice president of emerging technologies, SEMATECH.  “The joint research initiative with Canon ANELVA will aim to develop the various materials components needed for advanced NVM and evaluate the reliability of these materials.”

“We are excited to work with the most advanced technologists in developing  manufacturable solutions for tunnel oxide, charge trap materials, high-k and metal electrodes for advanced flash and other non-volatile memories,” said Naoki Watanabe, General Manager, Engineering Division2, Electronic Devices Engineering Headquarters.  “The collaboration combines Canon ANELVA’s experience in precision materials, low damage PVD, and related equipment platforms and SEMATECH’s strengths in the development of fundamental materials and advanced memory technologies.”

The collaboration will be conducted between the research teams of SEMATECH’s FEP device and reliability experts and Canon ANELVA’s semiconductor equipment engineers.

Related articles

RRAM technology start-up joins SEMATECH‚??s next-gen memory program - 12 April 2011

Nanosys joins SEMATECH‚??s Front End Processes program - 07 December 2010

Canon posts weak lithography tool sales: further decline expected - 30 April 2009

Cost-Of-Ownership Analysis For 300 mm Lithography Mix-and-Match Applications - 01 June 2000

Daniel Armbrust named president and CEO of Sematech - 18 November 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: