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Samsung, PDF Solutions collaborate on enhanced fault detection, classification solution

28 April 2009 | By Tom Cheyney | News > Wafer Processing

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PDF Solutions and Samsung Electronics are collaborating to further enhance PDF's YieldAware fault detection and classification (YA-FDC) package. The improved YA-FDC package will help reduce intended to reduce process variability in Samsung's fabs by controlling process tool health with models that predict the impact of tool sensor signals on final product yield.

"We are very impressed with the YA-FDC solution that controls the undesirable factors of process tools by modeling fabwide FDC signals with product yield, and we appreciate the opportunity to further the development of an improved system with PDF Solutions, one of the world's leading commercial providers of yield enhancement solutions," said C.S. Choi, executive VP of Samsung's system LSI division. "We look forward to enhancements to the current system for tool management, as well as reductions in process variability due to the tool variations at leading-edge technology nodes."

pdf_josephDavid Joseph, PDF's chief strategy officer (pictured), said that his company is "pleased to work with Samsung to extend the industry's only comprehensive system to model the impact of FDC signals on product yield and performance. The integrated offering is designed to tie tool parameter data with product yield information to improve product performance and reduce the cost of good die.

"The YA-FDC solution creates models that predict future product results from current wafer-by-wafer tool signals. Our work with Samsung is intended to help reduce variability in Samsung's high-volume fabs running its most advanced products."

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