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Rohm and Haas claims 20 percent reduction in tungsten CMP consumable costs
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Rohm and Haas Electronic Materials is claiming that a new groove design
for its ‘IC1000 AT’ and ‘VisionPad’ CMP pads achieves up to a 35
percent reduction in slurry consumption, which equates to approximately
a 20 percent reduction in the total cost of consumables for tungsten
CMP.
“Tungsten slurry is an extremely expensive component in the CMP
process, leading IC manufacturers to seek alternative solutions to
reduce the cost of consumables for this critical process step,” said
Mario Stanghellini, Executive Vice President of global sales and
marketing for Rohm and Haas Electronic Materials, CMP Technologies.
“Our understanding of CMP process fundamentals was instrumental in
delivering this step-out cost improvement for Tungsten CMP and directly
responds to the needs of our customers.”
The
new pad is being made available for 200mm and 300mm wafer processing
for full beta testing and is available for sampling by engaged
partners, according to the company.