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Rohm and Haas claims 20 percent reduction in tungsten CMP consumable costs

23 April 2008 | By Mark Osborne | News > Wafer Processing

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SlurryRohm and Haas Electronic Materials is claiming that a new groove design for its ‘IC1000 AT’ and ‘VisionPad’ CMP pads achieves up to a 35 percent reduction in slurry consumption, which equates to approximately a 20 percent reduction in the total cost of consumables for tungsten CMP.

“Tungsten slurry is an extremely expensive component in the CMP process, leading IC manufacturers to seek alternative solutions to reduce the cost of consumables for this critical process step,” said Mario Stanghellini, Executive Vice President of global sales and marketing for Rohm and Haas Electronic Materials, CMP Technologies. “Our understanding of CMP process fundamentals was instrumental in delivering this step-out cost improvement for Tungsten CMP and directly responds to the needs of our customers.”

The new pad is being made available for 200mm and 300mm wafer processing for full beta testing and is available for sampling by engaged partners, according to the company.

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