Online information source for semiconductor professionals

Replisaurus buys S.E.T. SAS to build its metallization systems

05 June 2008 | By Mark Osborne | News > Wafer Processing

Popular articles

Voltaix names Peter Smith as CEO - 09 November 2011

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

S.E.T SASReplisaurus Technologies, has acquired S.E.T. SAS to establish a production site for its proprietary ‘ElectroChemical Pattern Replication’ (ECPR) technology, used for TSV and other IC packaging integration schemes. S.E.T. Smart Equipment Technology is the former device bonder division of SUSS MicroTec and is based in France.

“S.E.T. significantly strengthens our position as an emerging key player in the advanced-packaging market, and this acquisition provides us with an exceptional team of highly skilled engineers with significant experience in building very precise and fully automated semiconductor tools,” said James Quinn, CEO of Replisaurus Technologies.

“Our complementary technologies and strategies make this a very good fit for both companies,” said Gaël Schmidt, Managing Director and President of S.E.T. “We are very excited to be a part of Replisaurus and to have the backing of its strong financial position.”

Related jobs

No related jobs found, sorry!

Related articles

STMicroelectronics’ Mike Thompson moves to Replisaurus as COO - 08 October 2008

Tool Order: SUSS MicroTec supplies spin coater to Replisaurus - 09 July 2008

The changing role of copper in IC manufacturing - 01 December 2003

Tool Order: SEMATECH orders wafer level bonder from SET - 01 September 2009

Tool order: Oerlikon Systems inks cluster tool deal with major foundry - 11 June 2010

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: