Following disruption to production after the earthquake, tsunami and nuclear disaster in Japan in March, Renesas Electronics has released a second updated preliminary schedule for its Naka wafer fabrication factory in Hitachinaka, Ibaraki. The update states that the company has moved its scheduled resumption of test and mass production at the company’s 200mm wafer fabrication lines from June 15 to June 1, and expects production to be back at the pre-earthquake level by the end of July.
The company’s 300mm wafer fab line began test production on April 25, and repairs to damaged equipment are near completion. As a result, the previously advertised start of mass production on this line has been moved back from July to June 6.
Renesas has been able to add capacity faster than projected by moving interim production activities to the company’s other factories and external foundries. Shipments of Naka-produced products are expected to gradually start at the end of August.