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Renesas to exit back-end IC equipment business

28 October 2009 | By Mark Osborne | News > Fab Management

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Renesas Technology is to transfer its back-end IC packaging equipment manufacturing arm to Hitachi High-Technologies. Renesas Eastern Japan Semiconductor had revenue of 6.0 billion yen in fiscal 2008 and employed 2,380 with 115affected by transfer. Hitachi High-Tech had been responsible for sales for the Renesas division. The transfer is expected to be completed in the spring of 2010.

Hitachi High-Technologies aims to establish and strengthen its business base in the semiconductor back-end process equipment business, where market expansion is widely anticipated in the next few years.

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