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Renesas to exit back-end IC equipment business
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Renesas Technology is to transfer its back-end IC packaging equipment
manufacturing arm to Hitachi High-Technologies. Renesas Eastern Japan
Semiconductor had revenue of 6.0 billion yen in fiscal 2008 and
employed 2,380 with 115affected by transfer. Hitachi High-Tech had been
responsible for sales for the Renesas division. The transfer is
expected to be completed in the spring of 2010.
Hitachi High-Technologies aims to establish and strengthen its business base in the semiconductor back-end process equipment business, where market expansion is widely anticipated in the next few years.