Online information source for semiconductor professionals
Renesas to exit back-end IC equipment business
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: ASML Brionâ??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011
Renesas Technology is to transfer its back-end IC packaging equipment
manufacturing arm to Hitachi High-Technologies. Renesas Eastern Japan
Semiconductor had revenue of 6.0 billion yen in fiscal 2008 and
employed 2,380 with 115affected by transfer. Hitachi High-Tech had been
responsible for sales for the Renesas division. The transfer is
expected to be completed in the spring of 2010.
Hitachi High-Technologies aims to establish and strengthen its business base in the semiconductor back-end process equipment business, where market expansion is widely anticipated in the next few years.