Online information source for semiconductor professionals

Renesas Electronics provides impact assessment update: 300mm fab remains closed

23 March 2011 | By Mark Osborne | News > Cleanroom

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Renesas Electronics Corporation, Takasaki Factory (Front-end line)Renesas Electronics has detailed the operational status of its group of semiconductor manufacturing facilities after the recent disaster and power supply issues dogging manufacturers to kick-start production.

Renesas said that it intends to add details of the impact from the earthquake to its financial results when confirmed information is available.

From the chart below it is clear that power disruption and ongoing rolling blackouts are making a return to full production impossible at a high-number of facilities. Renesas’ 300mm fab in Ibaraki remains shut as the company assesses potential unidentified issues in the cleanroom. Renesas noted that only limited power had been restored at the moment.

Related articles

Renesas Electronics attempts at restoring IC production: 300mm fab out until July, 2011 - 28 March 2011

Renesas to resume Naka factory operations earlier than planned - 11 May 2011

NEC Electronics and Renesas in major merger - 27 April 2009

Panasonic and Renesas readies 28nm development line - 30 September 2009

NEC and Renesas merger set for April, 2010 - 15 December 2009

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: