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Qimonda starts volume production of Buried Wordline DRAM

05 November 2008 | By Mark Osborne | News > Wafer Processing

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Qimonda starts volume production of Buried Wordline DRAMQimonda AG has said that it is now in volume production of its 65nm Buried Wordline technology at its 300mm fab in Dresden, Germany. First revenue from its 65nm 1Gbit DDR2 devices were received in October, the company said. Qimonda is currently producing several hundred 300mm wafers per month of the new technology.

“With the start of commercial production of our 65nm Buried Wordline technology, we have achieved a major milestone on our new technology roadmap,” said Kin Wah Loh, President and CEO of Qimonda AG. “We have increased wafer starts for 65nm Buried wordline at our lead fab in Dresden to several hundred wafers per month and plan to convert additional capacities in the coming months. The 65nm process demonstrated high yields and we have received very positive feedback from the customers that had received samples, especially regarding the low power consumption feature of our new Buried Wordline technology. In addition we have achieved first yield on our next generation 46nm Buried Wordline technology ahead of schedule and are well on track to start mass production by mid 2009. Offering more than twice the number of bits compared to the 65nm technology, the introduction of our 46nm technology will be a major step towards our goal of technology leadership in manufacturing.”

Qimonda has also achieved first yields on the next generation 46nm Buried Wordline technology and has taped out what it believes is the worldwide smallest 2G DDR3 chip based on this technology.

Buried Wordline technology replaces long-running deep-trench technology as Qimonda’s lower cost, low power next generation process technology. The DRAM manufacturer claims that its 65nm Buried Wordline technology increases the number of bits per wafer by more than 40 percent compared to the 75nm trench technology. The 46nm technology with 6F2 cell sizes potentially offers more than twice the number of bits per wafer compared to the 65nm Buried Wordline technology – an improvement of 200 percent as compared with the 75nm deep-trench node, currently in mainstream production at Qimonda.

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