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Qimonda cuts wafer starts at Dresden 300mm fab

10 February 2009 | By Mark Osborne | News > Cleanroom

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Qimonda, 300mm fab, DresdenQimonda AG has been forced to reduce production at its last remaining DRAM production facility to preserve cash and demonstrate to potential investors that its 46nm ‘Buried Wordline’ technology is competitive with rivals such as Samsung and Hynix. With the closure of its 300mm fab in Richmond, Virginia, the Dresden facility is Qimonda’s single remaining production facility.

“We will reduce wafer starts at Dresden in order to reduce costs and safeguard liquidity. With this liquidity, we intend to expedite the development of our 46nm Buried Wordline technology, with which we can achieve market leading productivity and efficiency”, said Frank Prein, General Manager of Qimonda Dresden GmbH & Co. OHG. “The preliminary insolvency administrator and the creditors’ committee have agreed to this approach.”

In its search for new investors, which must be found by the end of March in order to avoid complete bankruptcy, the company said that it was in early discussions with a potential investor.

 

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