Online information source for semiconductor professionals

Qimonda cuts wafer starts at Dresden 300mm fab

10 February 2009 | By Mark Osborne | News > Cleanroom

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Qimonda, 300mm fab, DresdenQimonda AG has been forced to reduce production at its last remaining DRAM production facility to preserve cash and demonstrate to potential investors that its 46nm ‘Buried Wordline’ technology is competitive with rivals such as Samsung and Hynix. With the closure of its 300mm fab in Richmond, Virginia, the Dresden facility is Qimonda’s single remaining production facility.

“We will reduce wafer starts at Dresden in order to reduce costs and safeguard liquidity. With this liquidity, we intend to expedite the development of our 46nm Buried Wordline technology, with which we can achieve market leading productivity and efficiency”, said Frank Prein, General Manager of Qimonda Dresden GmbH & Co. OHG. “The preliminary insolvency administrator and the creditors’ committee have agreed to this approach.”

In its search for new investors, which must be found by the end of March in order to avoid complete bankruptcy, the company said that it was in early discussions with a potential investor.


Related articles

Insolvency proceedings start for Qimonda as workforce shifts to ‚??transfer‚?? company - 01 April 2009

Qimonda starts volume production of Buried Wordline DRAM - 05 November 2008

Qimonda cuts capex; halts Singapore fab construction - 23 January 2008

DRAM capacity cuts greater than claimed, says DRAMeXchange - 13 January 2009

Qimonda exits U.S.-based manufacturing - 04 February 2009

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: