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Qcept Technologies Inc. has announced that a top memory manufacturer will evaluate its ChemetriQ non-visual defect (NVD) inspection solution for use in its most advanced pilot-production line.

The ChemetriQ system’s main use is inspecting memory wafers incorporating sub40nm design rules in addition to inspecting advanced R&D wafers that incorporate novel materials, processes and device structures.

Qcept’s ChemetriQ system is being evaluated for various applications including inline yield learning to accelerate ramp-up of next-generation processes, excursion monitoring, and pre-scanning prior to sending wafers to the analytical lab to enable faster root-cause analysis of NVDs. The evaluations will be performed at a number of process steps, such as post-etch cleans, post-chemical mechanical planarization (CMP) cleans, pre-diffusion cleans, and incoming wafer inspection.

“Despite the current downturn in the semiconductor industry, leading IC manufacturers continue to invest in new technologies that help them to transition to the next node and quickly ramp up their yields on their next-generation products,” said the President of Qcept Technologies, Erik Smith. “As the percentage of non-visual defects found in advanced IC manufacturing continues to rise due to tighter process tolerances, as well as the growing number of process steps and new materials, the gap between what defects are seen by optical inspection tools and what actually correlates to yield is growing. Leading manufacturers recognize this trend and its potential impact to their bottom line, and are turning to NVD inspection solutions, like our ChemetriQ technology, to enhance their total yield management strategy.”