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Qcept Technologies, Inc., the wafer inspection systems company, and CEA-Leti, the micro- and nanotechnology research organization, have signed an agreement that will see them collaborate on advanced semiconductor process development.  High-k and low-k dielectrics, ALD, and FUSI metal gates are among the technologies being researched and examined under the new agreement.

Utilising Qcept’s ChemetriQ (pictured) non-visual defect wafer inspection technology, the two companies will undertake the process characterization in CEA-Leti’s development facility in Grenoble, France.

"Advanced materials and processes, such as high-k dielectrics and metal gates, have the potential to significantly enhance the performance of future generations of semiconductor devices.  However, their complexity can give rise to new and unique yield problems, which require innovative inspection methods," said Adrien Danel, lead Research Engineer at CEA-Leti.  "This partnership with Qcept can help us to better understand the yield issues surrounding these materials and processes in order to speed their development and integration into full-scale manufacturing."

By Síle Mc Mahon