Online information source for semiconductor professionals

ProMOS gets 50nm DRAM stack process technology from Hynix

09 May 2008 | By Mark Osborne | News > Wafer Processing

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

ProMOS Hynix Semiconductor is to provide ProMOS Technologies with its 50nm DRAM stack process technology in exchange for capacity at its 300mm fabs. The company will also make an investment in ProMOS shares of between 8-10 percent, worth approximately $180 million.

To achieve timely technology transfer, Hynix plans to commence the government filing process immediately.

Related jobs

Nanofabrication Facility Operations Manager - National Institute of Standards and Technology - Gaithersburg, 28 August 2008

Embedded Control Systems HW & SW Engineer-Semiconductor Processing Equipment! - MKS Instruments, Inc. - Wilmington, 05 September 2007

Principal Embedded Software Engineer - MKS Instruments, Inc. - Wilmington, 05 September 2007

Staff R&D Engineer - Synopsys - Mountain View, 23 August 2007

Yield Ramp Consultant - Synopsys - Austin, 23 August 2007

Related articles

Tool Orders: ProMOS in follow-on orders with Mattson - 12 September 2005

Hynix makes significant cuts in DRAM and NAND flash production - 18 September 2008

Hynix in 200mm DRAM fab review: Eugene, Oregon fab to close in September - 24 July 2008

DRAM node migrations to fail in profitability goals, says DRAMeXchange - 29 October 2008

DRAMeXchange projects DRAM capex to fall 47% in 2009 - 06 January 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: