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Powerchip breaks ground on next two 300mm fabs
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Powerchip Semiconductor Corporation (PSC) has officially broken ground
on its next two 300mm fabs, dubbed P4 and P5, at an estimated combined
cost of approximately $8.2 billion. Each fab will have a capacity of
60,000 wafer starts per month (wspm) when fully ramped.
Typically, cleanroom completion can be expected within 12 months and
first phase tool install can be expected one to two months later.
Initial production can be expected in the fourth quarter of 2009 at one
of the facilities.
PSC
said that the new fabs will use sub-50nm process technology to produce
DRAM and NAND flash devices. PSC said that with the addition of the two
new fabs it would become one of the top three manufactures in the
memory market.