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Powerchip breaks ground on next two 300mm fabs

08 April 2008 | By Mark Osborne | News > Cleanroom

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PSCPowerchip Semiconductor Corporation (PSC) has officially broken ground on its next two 300mm fabs, dubbed P4 and P5, at an estimated combined cost of approximately $8.2 billion. Each fab will have a capacity of 60,000 wafer starts per month (wspm) when fully ramped.

Typically, cleanroom completion can be expected within 12 months and first phase tool install can be expected one to two months later. Initial production can be expected in the fourth quarter of 2009 at one of the facilities.

PSC said that the new fabs will use sub-50nm process technology to produce DRAM and NAND flash devices. PSC said that with the addition of the two new fabs it would become one of the top three manufactures in the memory market.

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