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Order Focus: Mattson‚??s Helios XP RTP system to be used by Asian foundry

11 January 2011 | By Mark Osborne | News > Wafer Processing

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A major Asian foundry has selected the Helios XP rapid thermal processing (RTP) system from Mattson Technology for 4Xnm production and development work. According to Mattson the evaluation system was recently shipped and installed at the end of the fourth quarter 2010.

"This major Asian foundry customer's selection reinforces Mattson Technology's strategic expansion into the critical foundry market," said Andreas Toennis, senior vice president and general manager of Mattson Technology's Thermal Products Group. "Our customer chose the Helios XP for advanced device production and development at the 4X nm and below regimes based on the exceptional performance of our patented HotShield technology, which enables repeatable within-wafer and wafer-to-wafer uniformity and reduces common thermal-related pattern loading effects, resulting in excellent process yields."

The unnamed foundry has been a long-standing customer of the equipment supplier.

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