Online information source for semiconductor professionals
Order Focus: Mattsonâ??s Helios XP RTP system to be used by Asian foundry
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
A major Asian foundry has selected the Helios XP rapid thermal processing (RTP) system from Mattson Technology for 4Xnm production and development work. According to Mattson the evaluation system was recently shipped and installed at the end of the fourth quarter 2010."This major Asian foundry customer's selection reinforces Mattson Technology's strategic expansion into the critical foundry market," said Andreas Toennis, senior vice president and general manager of Mattson Technology's Thermal Products Group. "Our customer chose the Helios XP for advanced device production and development at the 4X nm and below regimes based on the exceptional performance of our patented HotShield technology, which enables repeatable within-wafer and wafer-to-wafer uniformity and reduces common thermal-related pattern loading effects, resulting in excellent process yields."
The unnamed foundry has been a long-standing customer of the equipment supplier.