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ON Semiconductor switches off more fabs in 2009
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ON Semiconductor is increasing the number of fabs it plans to close in 2009 as part of a new round of cost reduction measures during the current industry downturn. In 2008, the company announced the planned closure of three legacy fabs, a 100mm, 120mm and a 150mm fab that would take place by the end of 2009. The company now plans to bring these closures forward to mid-2009 as well as evaluating a fourth front-end fab for closure by the end of 2009.
The chip manufacturer is also planning fab shutdowns of between 4-6 weeks over the current and second quarters of 2009. Capital expenditures have been reduced to between US$50-US$60 million in 2009, compared to previous guidance of between US$130-US$140 million.