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Oerlikon offloads two semiconductor equipment units

26 January 2009 | By Mark Osborne | News > Wafer Processing

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BE Semiconductor Industries N.V. has purchased for an undisclosed amount, Oerlikon Assembly Equipment AGWith a major downturn now taking place in the semiconductor industry, Oerlikon Corporation AG has sold two of its remaining semiconductor business units as it attempts to realign its businesses away from the volatile sector. BE Semiconductor Industries N.V. has purchased for an undisclosed amount, Oerlikon Assembly Equipment AG, which includes its Esec business unit, known for its die bonding equipment. Oerlikon also expects to agree a management buyout of the Etch business from Oerlikon Systems as it seeks to focus on PVD technologies.

"Oerlikon continues to fulfill its commitment to streamline its portfolio. Oerlikon has significantly reduced its exposure to the cyclical semiconductor market and can focus on its core competence in applications for thin film and coating," noted Dr. Uwe Krüger, CEO of the Oerlikon Group."We are satisfied that Esec will be integrated in the operations of an experienced, strategic partner who will continue to utilize the main technologies and products of Oerlikon Esec, as well as the expertise of its employees."

The purchase of Esec by BE Semiconductor is intended to boost its market share as an assembly equipment company and gain further access to accounts at ST Microelectronics, STATS Chip PAC, Infineon, ASE, SPIL, UTAC and Fairchild Semiconductor.

Oerlikon said that 70 jobs would be lost at the Esec assemby site in Cham, Switzerland and another 80 jobs will be cut in the Esec group worldwide.

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