Online information source for semiconductor professionals
NXP signs service contract with Applied Materials
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: ASML Brionâ??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011
A five-year contract to service all Applied Materials chip production equipment at NXP Semiconductor’s facility in Nijmegen, Holland has been signed with the equipment company. Through its Applied Performance Service program, over 70 Applied Materials systems at NXP’s 8-inch wafer facility will be covered by the new contract. Applied will also hire NXP engineers to become members of Applied’s on-site service team.“We expect to lower our overall costs and increase operational flexibility by leveraging Applied’s depth of expertise in both service and equipment engineering,” said Rutger Wijburg, vice president and manager of Front End Operations at NXP Semiconductor. “Applied will be responsible for maximizing tool performance, freeing us to focus on our primary mission: delivering High Performance Mixed-Signal integrated circuits for automotive, lighting and power applications.”
Under the agreement, a team of local and internationally located Applied certified engineers will provide NXP with 24x7 support using advanced engineering and logistics technologies, including Applied’s ‘ExpertConnect’ remote diagnostic capability and Applied E3™ equipment performance tracking and diagnostic software.