Online information source for semiconductor professionals

Nissan Chemical to work with SEMATECH on EUV materials

10 January 2011 | By Mark Osborne | News > Lithography

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Japanese chemical, Nissan Chemical has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. The company will collaborate with SEMATECH engineers on advanced adhesion enhancing materials in extreme ultraviolet (EUV) lithography such as edge roughness (LER), elimination of pattern collapse in images below 22 nm, and ultimate resolution of new resists.

“Our partnership with NCI will help strengthen the RMDC’s ability to address critical issues in adhesion enhancing materials,” said John Warlaumont, vice president of Advanced Technologies at SEMATECH “This new collaboration illustrates the effectiveness of SEMATECH’s efforts to include a broader range of industry participants in the search for new solutions to our common technology challenges.”

Related articles

SEMATECH offers hope for 45nm low-k target - 28 September 2005

SEMATECH and Canon ANELVA to team on non-volatile memory - 16 April 2009

SUSS MicroTec joins FEP program at SEMATECH - 10 December 2009

Dow Electronic Materials joins SEMATECH‚??s development of EUV resists - 11 February 2010

UMC establishes 22nm node R&D partnership with SEMATECH - 28 July 2008

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: