Online information source for semiconductor professionals

Nikon enters double patterning market with its NSR-S620 ArF immersion scanner

20 November 2008 | By Mark Osborne | News > Lithography

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

NSR-S620 ArF immersion scannerNikon is to release a new double patterning (DP) specific 193nm ArF immersion scanner by the end of 2009, the company has announced. The NSR-S620 ArF immersion scanner has been improved to handle higher wafer throughput to tackle the cost impediment of double the number of exposures.

Nikon said that improvements to its Local Fill nozzle for water delivery and retrieval as well as its Tandem Stage wafer station enable the tool to be used for volume production.

Nikon is the preferred lithography supplier for double patterning at Intel Corp as it transitions to 32nm in late 2009, using DP for the first time.

Related articles

Tool Order: Cymer installs first field-selectable 60‚??90 watt immersion light source - 22 July 2009

Tool order: Cymer announces first 90W XLR 600i purchase - 11 July 2008

Powerchip taps Nikon and Synopsys in better yielding 42nm flash - 26 February 2009

New Product: Nikon‚??s NSR-S610C immersion tool uses 1.30 NA catadioptric lens for sub-45nm patterni - 20 September 2006

New Product: Nikon‚??s S620D offers 2nm overlay for 22nm production with Streamlign platform - 03 March 2011

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: