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NEXX Systems licenses Alchimer’s eG ViaCoat technology for TSV applications

09 October 2008 | By Mark Osborne | News > Wafer Processing

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Stratus plating platformNEXX Systems has taken out a license for Alchimer's eG ViaCoat Cu seed material for through-silicon via (TSV) applications. Alchimer will supply NEXX with process recipes for eG ViaCoat and the use of chemistries to optimize wet Cu TSV metallization. This is the first licensing agreement related to 300mm tools, according to Alchimer.

“The unparalleled performance of ViaCoat enables us to further increase the productivity of our Stratus plating platform at lower cost. ViaCoat provides a less complex solution for copper seed than competitive solutions that require additional tool sets with attendant high costs," says Dick Post, Chairman of NEXX Systems. "We are pleased to enter into such an agreement with Alchimer at a time when cost reduction is so critical to making 3D packaging meet the required cost targets.”

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