Online information source for semiconductor professionals

NexPlanar to open a new CMP pad plant in Hillsboro, Oregon

20 December 2010 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

�??Velocity�?? the new buzzword in Intel�??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

NexPlanar will open a new 18,000 square foot manufacturing facility in Hillsboro, Oregon by the end of the year to meet increased demand. Approximately 10 new jobs will be created, NexPlaner said.

“Because of the unique design of our product, customers in the US and Asia have been qualifying NexPlanar’s pads and it became necessary to increase capacity,” noted Jim LaCasse, NexPlanar CEO. “We also wanted to have the ability to incrementally increase capacity in the future. This new Hillsboro site provides for a significant capacity increase and the flexibility needed for the future.”

NexPlanar also manufactures CMP pads in Minneapolis, MN.

NexPlanar completes $14.5 million financing round to fund new CMP pad technology - 11 July 2008

NexPlanar receives investment to expand CMP pad production - 26 March 2010

IDT switches semiconductor production to TSMC - 07 August 2009

Intel adds another 300mm fab to new build program - 21 February 2011

Local media reports Hynix in talks with solar companies about Eugene, OR, fab - 26 July 2008

Reader comments

No comments yet!

Post your comment

Advanced search