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NexPlanar completes $14.5 million financing round to fund new CMP pad technology

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NexPlanarNexPlanar Corporation has announced its completion of a $14.5 million round of financing that will enable them to market and commercialize its new CMP pad technology. The company uses proprietary "nano-domain" technology, which, according to the company, improves planarity, across-wafer uniformity and the most advanced CMP applications.

The funding round, which was led by InterWest Partners, included the following investors: BlueRun Ventures, Smart Forest Ventures, Fina Ventures, Intel Capital and Entegris.

By Síle Mc Mahon

 

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