Online information source for semiconductor professionals
NexPlanar completes $14.5 million financing round to fund new CMP pad technology
Popular articles
Voltaix names Peter Smith as CEO - 09 November 2011
Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
NexPlanar Corporation has announced its completion of a $14.5 million
round of financing that will enable them to market and commercialize
its new CMP pad technology. The company uses proprietary "nano-domain"
technology, which, according to the company, improves planarity,
across-wafer uniformity and the most advanced CMP applications.
The funding round, which was led by InterWest Partners, included the following investors: BlueRun Ventures, Smart Forest Ventures, Fina Ventures, Intel Capital and Entegris.
By Síle Mc Mahon