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Nanosys joins SEMATECH‚??s Front End Processes program

07 December 2010 | By Mark Osborne | News > Wafer Processing

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Nanosys is partnering with SEMATECH to develop Flash memory technologies, via the consortium’s Front End Processes (FEP) program. The aim is to develop new materials and processing techniques to extend non-volatile memory for the 2Xnm node and below.   

“Nanosys’ unique expertise in process-ready, advanced material technology will complement our own device and process expertise,” commented Raj Jammy, SEMATECH vice president of emerging technologies. “We will work together to develop practical and promising approaches to address the continued scaling needs of the fast-growing non-volatile memory market.”

“SEMATECH provides Nanosys with an excellent development platform for our next generation Quantum Dot Memory (QDMTM) technology,” said Jason Hartlove, CEO of Nanosys. “This collaboration will further the commercialization of our advanced materials and yield solutions that are critical to the continued progress of the memory roadmap.”

SEMATECH and Nanosys plan to build a material and process infrastructure for both planar and future three-dimensional non-volatile memory technologies.

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