Online information source for semiconductor professionals
Nanosys joins SEMATECHâ??s Front End Processes program
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Nanosys is partnering with SEMATECH to develop Flash memory technologies, via the consortium’s Front End Processes (FEP) program. The aim is to develop new materials and processing techniques to extend non-volatile memory for the 2Xnm node and below. “Nanosys’ unique expertise in process-ready, advanced material technology will complement our own device and process expertise,” commented Raj Jammy, SEMATECH vice president of emerging technologies. “We will work together to develop practical and promising approaches to address the continued scaling needs of the fast-growing non-volatile memory market.”
“SEMATECH provides Nanosys with an excellent development platform for our next generation Quantum Dot Memory (QDMTM) technology,” said Jason Hartlove, CEO of Nanosys. “This collaboration will further the commercialization of our advanced materials and yield solutions that are critical to the continued progress of the memory roadmap.”
SEMATECH and Nanosys plan to build a material and process infrastructure for both planar and future three-dimensional non-volatile memory technologies.