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M+W Zander to build 200mm fab for ANGSTREM

27 June 2008 | By Mark Osborne | News > Cleanroom

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AngstremANGSTREM is to convert and existing fab to 200mm wafer production with the construction of support buildings and full conversion expected to be completed by the end of 2009. M+W Zander FE GmbH has been awarded the contract that is expected to cost approximately €150 million.

“After successful completion of the design phase, we are very pleased that ANGSTREM-T chose M+W Zander as their partner for the turn-key construction of the new and modern semiconductor factory,” Jürgen Wild, Speaker of the M+W Zander Management Board. “Overall, we regard the Russian market as extremely dynamic for our future business.”

The new ANGSTREM-T fab located in Zelenograd, Russia, will have a cleanroom of about 6,000 square meters and employ 180nm through 130nm process technologies, primarily on a foundry basis. ANGSTREM had previously purchased used 200mm equipment from AMD.

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