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Milestone: Applied Materials ships 2,500th CMP System

04 April 2008 | By Síle Mc Mahon | News > Wafer Processing

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AppliedApplied Materials has said that it has recently shipped its 2,500th CMP system as well as doubling its 300mm CMP installed base to nearly 1,000 systems in just a two-year period. The majority of these 300mm systems were the Applied ‘Reflexion’ LK platform.

"Our 2,500 CMP systems have brought manufacturable solutions to some of the toughest CMP challenges across multiple applications, including copper damascene, STI(1), oxide, polysilicon and tungsten," said Lakshmanan Karuppiah, General Manager of Applied's CMP division. "Our Reflexion LK system, which is already the leading CMP system for planarizing copper interconnects in logic applications, has now achieved production status at multiple memory customers, helping them succeed with their transition from aluminum to copper interconnects and accelerate their time to market."

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