Online information source for semiconductor professionals

Milestone: Applied Materials ships 200th Producer APF CVD system

09 May 2008 | By Mark Osborne | News > Wafer Processing

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

APF CDVApplied Materials has made its 200th Applied Producer APF CVD system shipment, a tool that uses a self-aligned double patterning (SADP) process to extend optical lithography to 45nm and beyond. According to Applied Materials, the Producer APF has become the CVD patterning tool of record at advanced logic, DRAM and flash manufacturers worldwide.

“The Producer APF system has been one of our most successful products, achieving exponential growth as customers adopted it into volume production for an increasing number of device layers,” said Derek Witty, General Manager of Applied’s blanket dielectric films division. “Customers continue to expand their use of our APF family of films as a critical lithography-enabling solution for device scaling in both front and back-end applications. In addition, the Producer GT platform enables a 100 percent improvement in APF productivity, thus significantly reducing cost of ownership.”

Related jobs

Customer Engineer - Applied Materials - Beijing , 21 February 2008

Customer Engineer - Applied Materials - Beijing, 05 February 2008

Production Engineer - Applied Materials - Beijing , 05 February 2008

Customer Engineer - Applied Materials - Shanghai , 05 February 2008

Reliability Manager - Applied Materials - , 05 February 2008

Related articles

New Product: Applied Materials’ Producer GT is productivity dream machine for fabs - 20 November 2006

New Product: Applied Materials adds 30 percent more silicon strain in the Producer Celera - 15 May 2007

New Product: New ‘Producer eHARP’ SACVD system from Applied meets 32nm STI gap-fill requirements - 21 July 2008

New Product: Oxide spacer system from Applied Materials enables 32nm self-aligned DP - 24 July 2007

Application of Advances in Reactor Design to Metal Etch Chambers for Availability, Cost, Process and - 01 June 2000

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: