Inspection and re-qualifying of production equipment and systems is ongoing at MEMC’s wafer plant in Utsunomiya, Japan. Improvements in power supply have led to an unspecified amount of 300mm production just over a month since the largest earthquake to hit Japan occurred on March 11. MEMC noted that it expected to return to full 300mm wafer production by the middle of May, 2011.
"I am very proud of the character and resolve displayed by our employees in responding to this disaster and recovery," commented Ahmad Chatila, MEMC's Chief Executive Officer. "As a company we came together, forming worldwide response teams within hours of the earthquake, to make certain that our first priority, the safety and security of all employees and their families, was assured. Also within hours of the quake, we began facility inspections and hundreds of additional employees around the world initiated efforts to repair damage and resume production. My sincerest thanks go out to our employees whose commitment and focus enabled us to resume production so quickly. However, our foremost thoughts remain with the Japanese people during the recovery."
MEMC also said that the small volume of 200mm wafer capacity at the facility would be moved ahead of the original schedule (3Q11) to the company's Ipoh, Malaysia site. MEMC expects to provide additional details as part of its first quarter earnings report on May 4.