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Mattson in sub-45nm flash anneal program with global semiconductor manufacturer

21 April 2008 | By Mark Osborne | News > Wafer Processing

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MattsonMattson Technology had its ‘Millios’ flash Rapid Thermal Processing (fRTP) system selected by a global semiconductor manufacturer for sub-45nm millisecond anneal process development. The fRTP annealing system is scheduled to ship to the manufacturer's 300mm advanced development fab in May, where it will be used for process and performance characterization of next generation flash RTP applications.

 "As the number of implant steps increases with each device generation, chipmakers face a myriad of complex technical challenges in which they must achieve increasingly smaller geometries and fabricate more powerful chips," noted Andreas Toennis, Senior Vice President and General Manager of Mattson Technology's Thermal Products Group. "The Millios system has already demonstrated the advanced capabilities to address advanced 45 nm and beyond processes and is well positioned to drive Mattson's growth. We look forward to working with this latest Millios customer, and are committed to supporting their expanded production capabilities in the future as well as their growth strategy to meet their customers' anticipated demand for leading-edge semiconductors, telecommunications, and digital convergence technology."

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