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Leti and R3Logic team on 3D silicon integration and packaging program

21 January 2010 | By Mark Osborne | News > Wafer Processing

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Leti and specialist EDA company, R3Logic are to collaborate on 3D silicon integration and packaging that will use a new generation of EDA tools provided by R3Logic to build 3D IC designs and methodologies for consumer and wireless applications. TSV placement and short-loop floor planning are key focuses that are intended to enable the management of all aspects of the design flow in an integrated fashion.
 
“With R3Logic’s presence in Grenoble and Leti’s leading design-and-process-technology research infrastructure, we have the full range of competencies of the ideal ecosystem working together,” said Laurent Malier, CEO of Leti. “We are confident this joint lab will accelerate the adoption of 3D-IC technologies by the semiconductor industry, which will better align its fabrication process, and by the mobile- and consumer-device industries, which will develop more-competitive products.”

Lisa McIlrath, CEO of R3Logic said, “We are collaborating with Leti for three reasons: their research and technology expertise will help us accelerate development of our tools, their business model allows us to better protect our IP, and finally, their immersion in a complete ecosystem that concentrates in the same region the full spectrum from R&D in advanced concepts to major global providers of mobile and consumer applications.”

The development program is expected to last three-years.

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