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Léti and Brewer Science are working on the development and integration of photosensitive and non-photosensitive coatings into MEMS manufacturing processes, where high aspect ratios are mandatory, and on organic coating layers for advanced KrF and ArF photoresist processes. The materials process flow work covers 3 Dimensional Packaging using Brewer Science temporary adhesives.

“We have, in a very limited time, achieved and characterized Unity Aspect Ratio vias on seventy microns thick wafers” says Nicolas Sillon, the Head of the Laboratory for advanced packaging and 3-D integration at Léti. “The developed technology based on WaferBond™ materials will accelerate the 3-D chip stacking projects we have at Léti. WaferBond™ materials have already been included in 3-D functional demonstrators delivered to key Léti partners. The results we presented at the 10th Electronics Packaging Technology Conference EPTC last December in Singapore are a world premiere.”

“The partnership with Léti has been extremely beneficial in achieving these successes”, says Tony Flaim, Chief Technology Officer at Brewer Science, Inc. “Léti works as a true partner, so we have jointly decided to strengthen and extend our collaboration in the framework of a 3-year, common lab.”