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Applied Materials is to collaborate with Taiwan’s Industrial Technology Research Institute (ITRI) on 3D IC processes and technology as part of its membership with Stacked-System and Application Consortium (Ad-STAC). ITRI selected Applied’s Etch, PVD, CMP and PECVD systems for the new program which will develop via first, via last and via reveal TSV process flows.

“Joining forces with a leading research institution such as ITRI is a very effective way to advance 3D technology and successfully integrate it into the manufacturing community,” said Dr. Randhir Thakur, Senior Vice President and General Manager of Applied’s Silicon Systems Group. “ITRI’s selection of Applied’s entire TSV suite is a testament to our integrated 3D packaging technology, a capability that is unparalleled in the industry.

“We plan to drive 3D IC integration and set up a pilot line in our 3D IC lab,” said Dr. Sheng-fu Horng, Deputy General Director of the Electronics and Optoelectronics Research Laboratories at ITRI. “ITRI provides an open environment for new pilot technologies. We have therefore selected the latest TSV equipment from Applied Materials so that we can offer companies from different fields, as well as research institutes, a unique environment to develop and test new technologies and products.”

Applied also joined the EMC-3D semiconductor equipment and materials consortium in February, 2009 to push forward with 3D IC technology.