Online information source for semiconductor professionals

ISMI‚??s ESH Technology Center attracts Applied Materials

01 February 2010 | By Mark Osborne | News > Cleanroom

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Applied Materials has become the newest member of the Environment, Safety and Health (ESH) Technology Center, part of International SEMATECH Manufacturing Initiative (ISMI). Applied is teaming with the centre to improve the environmental performance of its products and processes.

 “Applied Materials is excited about expanding our collaboration with ISMI and its member companies to enhance the industry’s sustainability initiatives,” said Bruce Klafter, senior director for EHS and Sustainability at Applied Materials. “Using technological innovation, action and commitment, we can work together to find solutions to improving the environmental performance of our products and processes.”   

The EHS Technology Center was formed in 2009 to provide a broad-based, collaborative platform for developing better environmental practices for the industry, with goals of increasing efficiency and reducing costs in semiconductor operations.

Related articles

Applied Materials new Singapore manufacturing hub to handle 50% of business flow - 13 April 2010

Applied Materials to joint set-up ‘Center of Excellence’ in advanced packaging in Singapore - 13 April 2011

Applied Materials reduces role in Sokudo - 23 June 2009

Applied Materials expands ‚??SunFab‚?? tool manufacturing in Taiwan - 23 July 2008

Applied Materials’ tender offer to expire - 18 December 2009

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: