Online information source for semiconductor professionals

ISMI’s ESH Technology Center attracts Applied Materials

01 February 2010 | By Mark Osborne | News > Cleanroom

Popular articles

Samsung and Micron gain most market share in DRAM crisis - 17 February 2009

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Applied Materials has become the newest member of the Environment, Safety and Health (ESH) Technology Center, part of International SEMATECH Manufacturing Initiative (ISMI). Applied is teaming with the centre to improve the environmental performance of its products and processes.

 “Applied Materials is excited about expanding our collaboration with ISMI and its member companies to enhance the industry’s sustainability initiatives,” said Bruce Klafter, senior director for EHS and Sustainability at Applied Materials. “Using technological innovation, action and commitment, we can work together to find solutions to improving the environmental performance of our products and processes.”   

The EHS Technology Center was formed in 2009 to provide a broad-based, collaborative platform for developing better environmental practices for the industry, with goals of increasing efficiency and reducing costs in semiconductor operations.

Related jobs

No related jobs found, sorry!

Related articles

Applied Materials reduces role in Sokudo - 23 June 2009

Applied Materials expands ‘SunFab’ tool manufacturing in Taiwan - 23 July 2008

Applied Materials’ tender offer to expire - 18 December 2009

Applied Materials breaks ground at Singapore Operations Center - 08 July 2008

Applied Materials plans equipment market dominance with Semitool takeover - 17 November 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: