Online information source for semiconductor professionals
IMEC and SUSS MicroTec join forces on wafer bonding development
Popular articles
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
IMEC and SUSS MicroTec have announced a collaboration that will see the companies work on the development of permanent bonding, temporary bonding and debonding processes for 3D system integration and TSV manufacturing. It is hoped that the cooperative move will improve wafer bonding processes and eventually bring 3D integration technology to maturity.
IMEC will use SUSS’s XBC300 production wafer bonder platform for the development of 200mm and 300mm permanent metallic interconnect bonding, and for temporary bonding and debonding solutions for its 3D-stacked Interconnect and 3D Wafer Level Packaging technology.
"We are very pleased to co-develop with SUSS MicroTec the processes for permanent and temporary wafer bonding for our 3D technologies," said Eric Beyne, Program Director of IMEC's Advanced Packaging and Interconnect Research Centre. "In particular, the debonding and handling of very thin wafers ranging from 25 to 50µm is an especially challenging and critical process. We are convinced that the versatility of the SUSS wafer bonding and debonding tool platform will contribute to bringing 3D integration technology to maturity."