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IDT switches semiconductor production to TSMC

07 August 2009 | By Mark Osborne | News > Cleanroom

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Moving from a fab-lite to a fabless business will take Integrated Device Technology (IDT) approximately two-years to complete as it plans to shift its product processes and geometries to TSMC. IDT intends plans to shutter its fab Hillsboro, Oregon and engage a third party to market the facility as a fully equipped going concern.

“Over the past year or so, IDT has been shifting gears towards developing application specific solutions for the communications, computing and consumer markets.  Obtaining an agreement with TSMC enables us to take full advantage of their cutting edge manufacturing processes and geometries and is the logical next step in our transformation,” said Mike Hunter, Vice President of Worldwide Manufacturing for IDT. “This agreement, which will combine IDT system expertise and architecture and the TSMC technology platform, expands our overall global manufacturing capability. It also officially starts the countdown for IDT to move from a fab-lite to a fab-less model.”

IDT’s Fab 4 facility in Hillsboro, Oregon uses 130nm and above process technology for fabricating its low-power, mixed signal IC devices.

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