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IBM & AMD aim alliance at the 22nm frontier

01 November 2005 | By Syanne Olson | News > Wafer Processing

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IBM and AMD have expanded and extended their semiconductor R&D alliance to include the 32nm and 22nm technology nodes. In an effort to develop the required processes for volume manufacturing at these nodes the alliance will be expanded to include more fundamental research into new materials that are expected to be required. According to IBM, this is the first time a technology alliance partner has teamed with IBM in such a way.

"By expanding our successful IBM alliance, we can significantly increase our level of early-stage research, focusing on technologies for the 32nm and 22nm technology generations. By influencing and participating in this research, AMD can better align its process technologies with the needs of our products scheduled to be introduced late in this decade and beyond."

"This agreement is a perfect example of IBM's strategy of collaborative innovation," said Bernie Meyerson, IBM Fellow, vice president and chief technologist, IBM Systems & Technology Group. "Working closely with our key development associates like AMD, we are able to bring advanced technology to market faster and more economically, providing added benefit to our customers."

The work will be carried out at IBM's Watson Research Center in Yorktown Heights, N.Y., the newly announced Center for Semiconductor Research at Albany NanoTech, and at IBM's 300 millimeter state-of-the-art manufacturing facility in East Fishkill.

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