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Hynix in 200mm DRAM fab review: Eugene, Oregon fab to close in September
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Hynix Semiconductor has officially announced that its 10-year-old 200mm
DRAM fab in Eugene, Oregon, U.S.A. will stop production and be
shuttered in September 2008. Approximately 1,200 people will lose their
jobs in the wake of the announcement.
The memory manufacturer also said that it was currently undertaking a
review of its other four 200mm DRAM facilities that are primarily
located in Korea, with one in China. The company noted that with a
shift to 300mm wafer production over the last few years, 200mm DRAM
fabs have become less competitive from a cost structure basis as well
as sparking a severe overcapacity situation.
Although
demand for DRAM continues to grow, the overcapacity has caused two
years of heavy price declines with ASPs often below manufacturing cost.