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Globalfoundries offers turnkey services for DFM, OPC and mask operations

14 June 2010 | By Mark Osborne | News > Wafer Processing

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In an attempt to go beyond the classic foundry approach of design enablement, Globalfoundries is set to offer customers turnkey services, which cover DFM, OPC and mask operations as well as advanced assembly solutions to tackle the needs of the broadest range of semiconductor applications. Dubbed ‘Globalsoltions,’ the new service or as the company describes as the ‘ecosystem’ is claimed to combine its internal technology resources with a broad spectrum of partners capabilities to efficiently enable the fastest time-to-volume production.

“As chip design grows in complexity and manufacturing partnerships become increasingly critical, foundry customer enablement needs to extend beyond process design kits and reference flows to include the full spectrum of the semiconductor value chain,” said Jim Kupec, Senior Vice President of Worldwide Sales and Marketing at GLOBALFOUNDRIES. “To this end, GLOBALSOLUTIONS includes ecosystem partners in all aspects of design enablement, turnkey services, design for manufacturability, optical proximity correction and mask operations, and will further expand our capabilities in advanced assembly solutions. This will allow our customers to unlock their innovation potential and differentiate at all levels of the design process, from the silicon and SoC level all the way up to the full system.”

The foundry also claims that some of competitors have deployed proprietary intellectual property, mask, and assembly operations to compete with ecosystem partners. Globalfoundries intention is to keep these systems open and collaborative, leveraging the best resources from around the world to deliver optimized solutions.

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