Online information source for semiconductor professionals
Globalfoundries joins imecâ??s sub-22nm core CMOS program: EUV lithography included
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Globalfoundries is partnering on sub-22nm CMOS scaling and GaN-on-Si technology with the nanoelectronics R&D center, imec. The foundry will join imec’s sub-22nm core CMOS program, which encompasses material and device studies, tool and process step exploration, integration options and advanced characterization. Globalfoundries will also collaborate on EUV lithography.“Globalfoundries has long embraced a collaborative approach to R&D innovation based on a model of shared objectives and shared investments with partners around the world,” said David Bennett, vice president of alliances at Globalfoundries. “The mission and capabilities of imec are highly complementary to our current collaborative R&D approach and will add another important dimension to our technology pipeline.”
The foundry will also join the imec GaN research program, which aims at high-performance, cost-effective GaN devices on 200mm silicon wafer.