Online information source for semiconductor professionals
Globalfoundries increases capacity of new 300mm fab
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
The shift to a foundry model goes deeper than a new name and logo, according to AMD spin-off Globalfoundries. With official groundbreaking at Fab2 in NY State expected to take place later this week, the new 300mm manufacturing facility has been redesigned since the announced spin-off to increase its capacity and improve tool layout that is both more cost effective and better suited to foundry operations, according to Thomas Sonderman, VP, Manufacturing Systems and Technology at Globalfoundries.
Originally, AMD had planned the capacity at the then named Fab4X to be in the region of 25,000wspm (wafer starts per month), the same as its 300mm fab in Dresden, Germany. Renamed Fab 2 by Globalfoundries the new fab will have a capacity of 35,000wspm when fully ramped.
Other important changes include a 2-level structure instead of the originally planned 3-level construction. This approach saves construction costs and simplifies facility support and tool hook-up systems.
Sonderman also noted that with the larger cleanroom area and new tool layout, Ion implant tools would be positioned on the edges, similar to the layout adopted by some of the major foundries, simplifying hook-up and tool management.
Construction timescales and ramp targets remain unchanged from previous Globalfoundries announcements.
