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Global equipment billings 13% lower than 1Q09

10 September 2009 | By Mark Osborne | News > Wafer Processing

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Global semiconductor equipment billings in 2Q09 came in at only US$2.69 billion. Billings were 13% lower than the previous quarter and 66% less than the same quarter a year ago. SEMI also reported bookings of US$2.95 billion in 2Q09, 58% less than the same quarter a year ago but 83% up on the first quarter of 2009.

“Spending for the first half of 2009 is comparable to spending reported in the early 1990s,” said Stanley T. Myers, president and CEO of SEMI. “While 2009 is an extremely challenging year for the industry, it is encouraging to observe improvement in equipment bookings over recent months.”

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