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Future DRAM on logic 3D IC revealed by IMEC

01 October 2009 | By Mark Osborne | News > Wafer Processing

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A new 3D chip named ‘Etna,’ which integrates a commercial DRAM device on top of a logic IC has been revealed by IMEC. The device is said to resemble future commercial iterations. IMEC said is was manufacturing the logic die in its prototype line, and will be stacking the commercial DRAM chip on top of it. One of IMEC's 3D integration partners will deliver the DRAM dies, and will test the fabricated 3D stack; two other partners, will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate.


"We are excited to achieve this milestone in collaboration with our 3D integration partners including memory suppliers and IC manufacturers,” commented Pol Marchal, principal scientist 3D integration at IMEC. “This test-chip is a significant step for the introduction of 3D technology in DRAM-on-logic applications."

IMEC didn’t comment on when the commercial device would made available.

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