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Fujitsu taps TSMC for advanced process production

30 April 2009 | By Mark Osborne | News > Wafer Processing

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Fujitsu Microelectronics is to use TSMC for 40nm technology product production and potentially collaborate on developing processes and product production at the 28nm node, discussions on the subject are intended, the companies said.

“From the aspect of its advanced process technologies and large-scale production capacity, TSMC is the most attractive semiconductor foundry partner”, said Haruki Okada, president of Fujitsu Microelectronics Limited. “By continuing to create our advantages in fine-pitch process technologies through this partnership, we can further grow our ASIC and ASSP product businesses.”

“Fujitsu Microelectronics is clearly a world-class leader in advanced high-speed and
low-power technologies, design engineering, and differentiated IP. Given TSMC's longstanding commitment to Japan's semiconductor market, and our on-going investment and dedication to advanced process technology, our collaboration with Fujitsu Microelectronics represents a new best-in-class solution for many system companies,” said Dr. Rick Tsai, president & CEO of TSMC.

Competition for major IDM business, especially at the leading-edge node is fierce. Fujitsu would seem to be planning a 5-year plus production deal with TSMC. Japan’s own Elpida has wanted to expand production into foundry operations as well as newly formed GLOBALFOUNDRIES.

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