Online information source for semiconductor professionals
Fujitsu taps TSMC for advanced process production
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Fujitsu Microelectronics is to use TSMC for 40nm technology product production and potentially collaborate on developing processes and product production at the 28nm node, discussions on the subject are intended, the companies said.
“From the aspect of its advanced process technologies and large-scale production capacity, TSMC is the most attractive semiconductor foundry partner”, said Haruki Okada, president of Fujitsu Microelectronics Limited. “By continuing to create our advantages in fine-pitch process technologies through this partnership, we can further grow our ASIC and ASSP product businesses.”
“Fujitsu Microelectronics is clearly a world-class leader in advanced high-speed and
low-power technologies, design engineering, and differentiated IP. Given TSMC's longstanding commitment to Japan's semiconductor market, and our on-going investment and dedication to advanced process technology, our collaboration with Fujitsu Microelectronics represents a new best-in-class solution for many system companies,” said Dr. Rick Tsai, president & CEO of TSMC.
Competition for major IDM business, especially at the leading-edge node is fierce. Fujitsu would seem to be planning a 5-year plus production deal with TSMC. Japan’s own Elpida has wanted to expand production into foundry operations as well as newly formed GLOBALFOUNDRIES.