Fujitsu Microelectronics has teamed with TSMC to jointly develop an enhanced 28nm high-performance process for its advanced logic devices which are expected to begin sampling towards the end of 2010. The move extends the partnership from 40nm through to 28nm processing. The companies also said that they were in discussions over collaboration on advanced packaging processes such as Cu/ELK interconnect.
"We are rapidly progressing in our previously-announced collaboration with TSMC on 40nm process technology, with several product designs in progress at present", commented Haruyoshi Yagi, Corporate Senior Vice President of Fujitsu Microelectronics Limited. "With this further agreement with TSMC on 28nm high-performance process technology development and production, we combine both companies' strengths to create greater value for our customers, and will further drive the growth of businesses for TSMC and Fujitsu's ASIC and ASSP core products."
“The agreement today is also a vote of confidence in TSMC's technology platforms that include design related considerations such as design kits, design flows, TSMC and 3rd party IP; robust device related documentation, processes technology excellence and backend assembly and test capabilities," noted Jason Chen, Vice President, Worldwide Sales and Marketing, TSMC.