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Fujifilm joins EUV resist program at SEMATECH

19 May 2011 | By Mark Osborne | News > Lithography

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Photoresist supplier, Fujifilm is joining SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany to collaborate on critical resist issues in extreme ultraviolet (EUV) lithography. SEMATECH’s RMDC will provide access to two micro-exposure tools (METs) as well as several metrology tools for Fujifilm’s photoresist development work.

“The leading-edge research and development at the UAlbany NanoCollege that is critical for the commercialization of EUVL technologies will be enhanced by the addition of FUJIFILM,” said Richard Brilla, CNSE vice president for strategy, alliances and consortia. “This further builds on the world-class capabilities enabled by the SEMATECH-CNSE partnership to support the advanced technology needs of our global corporate partners and the industry.”  

According to SEMATECH, the research collaboration will focus on the reduction or elimination of line edge roughness (LER) in images below 22nm; ultimate resolution of new resists; and testing imaging materials for EUV sensitivity.

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