Online information source for semiconductor professionals
FSI International extends ‘ViPR’ technology to NAND flash production
Popular articles
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Samsung and Micron gain most market share in DRAM crisis - 17 February 2009
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008
Numonyx to close California Technology Center - 12 August 2008
After an evaluation trial at an unnamed NAND flash manufacturer, FSI International has said that its all-wet photoresist stripping technology ‘ViPR’ can handle NAND flash devices. The customer was said to have replaced a two-step, ash-clean process with a single-step, without ashing.
“NAND technology continues to set the pace for shrinking device dimensions,” said Don Mitchell, FSI’s president and CEO. “Expanding the ZETA ViPR for NAND manufacturing verifies the critical value-add of all-wet stripping in advanced processes— value that will only increase as device dimensions continue to shrink. It’s rewarding to provide our customers with a truly differentiated process that can reduce cycle time and capital outlay and lower operating costs.”