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FSI International extends ‘ViPR’ technology to NAND flash production

24 March 2009 | By Mark Osborne | News > Wafer Processing

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After an evaluation trial at an unnamed NAND flash manufacturer, FSI International has said that its all-wet photoresist stripping technology ‘ViPR’ can handle NAND flash devices. The customer was said to have replaced a two-step, ash-clean process with a single-step, without ashing.

“NAND technology continues to set the pace for shrinking device dimensions,” said Don Mitchell, FSI’s president and CEO. “Expanding the ZETA ViPR for NAND manufacturing verifies the critical value-add of all-wet stripping in advanced processes— value that will only increase as device dimensions continue to shrink. It’s rewarding to provide our customers with a truly differentiated process that can reduce cycle time and capital outlay and lower operating costs.”

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