Online information source for semiconductor professionals

FSI International extends ‘ViPR’ technology to NAND flash production

24 March 2009 | By Mark Osborne | News > Wafer Processing

Popular articles

Voltaix names Peter Smith as CEO - 09 November 2011

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

After an evaluation trial at an unnamed NAND flash manufacturer, FSI International has said that its all-wet photoresist stripping technology ‘ViPR’ can handle NAND flash devices. The customer was said to have replaced a two-step, ash-clean process with a single-step, without ashing.

“NAND technology continues to set the pace for shrinking device dimensions,” said Don Mitchell, FSI’s president and CEO. “Expanding the ZETA ViPR for NAND manufacturing verifies the critical value-add of all-wet stripping in advanced processes— value that will only increase as device dimensions continue to shrink. It’s rewarding to provide our customers with a truly differentiated process that can reduce cycle time and capital outlay and lower operating costs.”

Related jobs

No related jobs found, sorry!

Related articles

Hynix delays 300mm fab ramp - 01 April 2008

DRAMeXchange expects 81% NAND flash bit growth in 2009 - 02 January 2009

Tool Order: Mattson wins multiple orders for ‘paradigmE’ etch system - 13 December 2010

DRAMeXchange details NAND Flash bit supply impact from Japan - 18 March 2011

IMFT migrates to 34nm NAND flash production - 24 November 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: