Online information source for semiconductor professionals

Freescale has said it will enter into 65nm node device prototyping in November

11 October 2005 | By Syanne Olson | News > Wafer Processing

Popular articles

Voltaix names Peter Smith as CEO - 09 November 2011

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Freescale Semiconductor plans to enter into 65nm IC prototyping in November of this year. Work will be carried out at the Crolles2 joint development facility with STM and Philips in Crolles, France. "We have addressed many of the industry's widely reported challenges with 90-nm and are applying our expertise to the next generations of technology," said Freescale's Chief Technology Officer Dr. Claudine Simson. "Our achievements at 90-nm over the past year set the stage for successful 65-nm prototyping, which we will begin in November."

Freescale started 90nm production on 300mm wafers at the same facility in October 2004 and now claims to have taped out 12 new products from the facility that where "right-the-first-time."

Related jobs

No related jobs found, sorry!

Related articles

Qualcomm to ramp 65nm at TSMC & IBM from 2Q06 onwards - 08 November 2005

Freescale sets up 200mm MEMS production line - 14 January 2008

Electrochemical deposition challenges for 65nm - 01 March 2003

e-Shuttle touts full-scale use of EBDW for 65nm logic ICs - 23 May 2008

Freescale taps credit agreement for $184 million - 22 January 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: